杨女士
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- 职位介绍
- Position statement: 1.Responsible for power module design requirement definition with marketing team and customers, include module’s electrical, mechanical, materials and reliability specs 2.Responsible for marketing research and competition analysis 3.Responsible for new module design include 3D modeling and material selection 4.Responsible for new module process flow definition 5.Responsible for tooling and fixture design for the new process 6.Responsible for new samples build 7.Responsible for new product development per company procedure and release to production line Requirements: 1.Bachelor Degree and above with professional degree in Semiconductor, Power electronics, Material science, Mechanical or relate subject 2.At least 2 years power module development working experience. 3.Required skill(s): Solidworks,Autocad, JMP, Black/Green belt 4.Preferred skill(s): Solidworks, Autocad, Black/Green belt 5.Able to gather, organize and analyze information/data to solve the problem 6.Good command of English in listening, speaking, reading and writing 7.Good team work 8.Full-Time positions available.
- 其他信息
- 语言要求:英语、普通话
公司简介
杭州芯通半导体技术有限公司是专业从事半导体封装测试的高新科技企业,总投资预计17亿人民币。前期在浙江大学科创中心设立汽车模块的封测试验线,并同时在杭州市富阳区建设5万平方的封测园区。
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