赫比国际
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电子/芯片/半导体 ·10000人以上 ·外商独资/外企办事处

Hi-P established its industrial roots as an insert molding and metal forming tool maker founded in 1980. In 1983, current Executive Chairman and Chief Executive Officer, Yao Hsiao Tung acquired management of company. After the worldwide recessions of the mid 80's, Hi-P's success flourished with the expansion of overseas manufacturing facilities in 1993. Robust growth throughout the next 10 years, Hi-P is now known as one of the many defining moments, a listing on SGX, the Singapore stock exchange. Today, as a leading contract manufacturing provider, Hi-P maintains a clear focus in contributing to our clients' competitive advantage by developing and providing manufacturing solutions of exceptional value. An efficient, continuous work flow, utilizing the latest in technology and waste-free operations are the hallmark of the company. Coupled with its solid relationships with clients, these elements have provided the economic support to allow Hi-P to grow as a business that lives by its core values of integrity and finding the best possible solutions for our customers.
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企业全称

赫比(上海)电子有限公司

成立时间

1992年01月24日

注册资本

4192万人民币

法人代表

姚晓东

注册地址

上海市浦东新区祝桥空港工业区金闻路77号3幢1楼B区

统一信用代码

913101156072007899

所属行业

电子技术/半导体/集成电路

所在地

上海

登记机关

浦东新区市场监督管理局

营业期限

1992-01-24

企业类型

有限责任公司(外国法人独资)

经营状态

存续

经营范围

生产销售精密模具及其软件和接插件,精密微型开关等电子零件,销售自产产品。在上海浦东张江路1616弄3号、4号内从事自有房屋租赁服务。 【依法须经批准的项目,经相关部门批准后方可开展经营活动】

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