Montage Technology, one of the leading fabless semiconductor companies, is committed to providing high-performance IC based solutions for cloud computing and artificial intelligent (AI) markets. Dedicated for more than 10 years in the memory interface technology, the company is able to deliver high-speed, large-capacity memory buffer solutions of DDR2 to DDR4 to meet the growing demand in data centers. Montage’s invention of DDR4 fully buffered “1+9” distributed architecture is adopted by JEDEC as an international standard, and its related products have successfully entered the industry mainstream memory, server and cloud computing fields and served the majority of the global market.
Since 2016, Montage has been cooperating with Tsinghua University and Intel to develop Jintide® CPU. A high-performance Jintide® server platform combining Jintide® CPU with Montage's hybrid security memory module (HSDIMM®) has been launched. The platform has realized real-time security monitoring function at silicon level and can play an important role in the information security field. This architecture also incorporates advanced heterogeneous processing and interconnect technologies for future AI and big data applications, which provides strong support of comprehensive data processing and computing power for various applications in the AI era.
Established in 2004, Montage Technology is headquartered in Shanghai and has branches in Kunshan, Xi'an, Macao, Silicon Valley of USA and Seoul of South Korea.